“WE HELP IP OWNER SECURE GOVERNMENT FUNDING”
ABOUT IP GRANTS
Southeast Asian Governments support the commercialisation and development of Intellectual Property (IP) assets through the offering of grants in an effort to drive innovation, establish new industries, and spur economic growth.
Eligible entrepreneurs and businesses can tap into such funding to help offset IP protection, development, and commercialisation expenses. Examples of such grants are Malaysia’s TeD1 & TeD2 (MOSTI), Singapore’s MRA grant (Enterprise Singapore), and Hong Kong’s Patent Application Grant.
These programs provide grant backing for processes such as patenting, market development, and technology development. Understanding eligibility criteria and application processes can allow innovators to optimize the utilization of available funds and introduce their concepts into the market.
Gov Grants For Patent
Singapore
Market Readiness Assistance
(MRA) Grant
Expand internationally with funding for IP strategies, including patents, trademarks, and market entry plans.
Hong Kong
Patent Application Grant
(PAG)
Secure up to 90% of your patent application costs to protect your inventions and establish your foothold in Hong Kong.
Malaysia
MOSTI Technology Development
Fund 1 & 2 (TeD 1 & 2)
Transform innovative ideas into impactful technologies by funding R&D and IP protection as part of your commercialization efforts.
THE MARKET READINESS ASSISTANCE (MRA)
Enterprise Singapore’s Market Readiness Assistance (MRA) Grant provides up to 70% funding support, capped at SGD 100,000 per company per new market, to support Singaporean SMEs in expanding into new international markets. It covers key activities such as overseas market promotion, business development, and market setup.
TeD1 and TeD2 (MOSTI)
MOSTI’s Technology Development Fund (TeD 1 & TeD 2) and Bridging Fund provides Malaysian companies, researchers, and startups, that are developing science, technology, and innovation (STI) projects with strong commercialisation potential, with financial support. TeD 1 funds early-stage R&D with a cap of RM 1 million. TeD 2 supports late-stage R&D with a cap of RM 3 million. Pre-commercialisation activities are supported by the Bridging Fund, the funding is capped at RM 4 million.
The Patent Application Grant (PAG)
Hong Kong’s Patent Application Grant is a government initiative that aims to encourage local companies and inventors to secure protection for their innovations via patents. The grant is administered by the Innovation and Technology Commission (ITC) and managed by the Hong Kong Productivity Council (HKPC). The funding is capped at HKD 250,000 per application and is available to companies registered in Hong Kong or Hong Kong permanent residents.
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Email: consulting@pintas-ip.com
Pintas Advisory PLT
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KL Sentral , 50470 Kuala Lumpur,
Malaysia.
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Email : consulting@pintas-ip.com
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